铟锡氧化物(ITO)和al掺杂ZnO (AZO)界面层在n型锗上的欧姆接触

P. P. Manik, Ravi K. Mishra, U. Ganguly, S. Lodha
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摘要

只提供摘要形式。最近的报道从实验和理论的角度证明了ZnO作为非钉住的低电阻金属-界面层-半导体(MIS)接触的界面层的适用性。界面层的掺杂水平可以通过控制隧道势垒宽度来显著影响接触电阻。在这项工作中,我们比较了al掺杂(2%)ZnO (AZO)和铟锡氧化物(ITO, 5% Sn)以及之前报道的退火(n+) ZnO界面层。所有三层都在n-Ge上解开费米能级,并且具有几乎相似的导带偏移(~-0.1 eV)。然而,与AZO和ZnO相比,ITO基n-Ge触点表现出较低的厚度依赖性和较高的电流密度,这可能是由于ITO层中掺杂较多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Indium tin oxide (ITO) and Al-doped ZnO (AZO) interfacial layers for Ohmic contacts on n-type Germanium
Summary form only given. Recent reports have demonstrated the suitability of ZnO as an interfacial layer for unpinned, low resistance metal-interfacial layer-semiconductor (MIS) contacts on n-Ge from experimental and theoretical standpoints. The doping level in the interfacial layer can significantly impact the contact resistance by controlling the tunnel barrier width. In this work we have compared Al-doped (2%) ZnO (AZO) and Indium tin oxide (ITO, 5% Sn) along with annealed (n+) ZnO interfacial layers reported earlier. All three layers unpin the Fermi level on n-Ge and have nearly similar conduction band offsets (~-0.1 eV). However ITO-based n-Ge contacts exhibit lower thickness dependence and higher current densities as compared to AZO and ZnO, likely due to the higher doping in the ITO layer.
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