Packaging Developments For Optoelectronic Components In Broadband Communication Networks

introduction European collaborative programs being carried out under the RACE (Research and Dcvelopnient of Advanced Communications in Europe) banner are aimed at the realisation of an Integrated Broadband Communications (IBC) network. These programs are the drivers for new optical system applications such as the use of optical backplane interconnect, wave division multiplexing techniques, optical broadband switching and crucial to the commercial succcss. low cost networks. System projects within RACE are addressing the introduction of optical technology into telecommunication networks with developments broadly grouped into four theme areas the core network, the access network, switching fabric and radio/mobile. Othcr projects are developing a comprehensive range of advanced optoelectronic components that iire needed to satisfy the system requirements and only major advance in the difficult packaging technology has enabled the necessary performance, size and cost targets to be real i sed. Component packaging/interconnect developments can be catergorised into a number of key areas that are linked to the system themes mentioned above: fibre alignment and fixing to device arrays (core, switching, access) .high speed packaging design (core, switching) backplane interconnect and data interconnect techniques (switching) low cost technologies (access, radio) manufacture and downstream issues ( an important area linked to all components) The three examples below give a sample representation of component development in these critical areas.