数字CMOS电路的地弹跳分析与优化

P. Heydari, Massoud Pedram
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引用次数: 14

摘要

本文对数字CMOS电路的地弹跳特性进行了分析和优化。首先,提出了一种计算地面弹跳的解析方法。该方法依赖于短通道MOS器件和芯片封装接口寄生的精确模型。其次,讨论了地弹跳对缓冲器传播延迟的影响和最佳锥度因子,并得到了有地弹跳时总传播延迟的数学关系式。分析了片上去耦电容对地弹跳波形和电路性能的影响,给出了片上去耦电容对地弹跳差模分量峰值的封闭表达式。最后提出了一种控制输出驱动器开关次数的设计方法,以使地弹跳最小化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis and optimization of ground bounce in digital CMOS circuits
This paper is concerned with the analysis and optimization of the ground bounce in digital CMOS circuits. First, an analytical method for calculating the ground bounce is presented. The proposed method relies on accurate models of the short-channel MOS device and the chip-package interface parasitics. Next the effect of ground bounce on the buffer propagation delay and the optimum taper factor is discussed and a mathematical relationship for total propagation delay in the presence of the ground bounce is obtained. The effect of the on-chip decoupling capacitor on ground bounce waveform and the circuit performance is analyzed next and a closed form expression for the peak value of the differential mode component of the ground bounce in terms of on-chip decoupling capacitor is provided. Finally a design methodology for controlling the switching times of the output drivers to minimize the ground bounce is presented.
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