光子集成电路技术及应用趋势

T. Koch
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引用次数: 4

摘要

光子集成电路的研究最初集中在将各种不同的光波导元件与最小的制造和外延复杂性相结合的技术挑战上。用于记录这项技术进展的工具往往先于任何真正的市场机会,而不是希望刺激依赖于PICs可能带来的大幅成本节约的应用程序的开发。有了这个模型,WDM就有可能成为PIC技术的备选方案。从低啁啾集成激光电吸收调制器源到大功率主振荡器功率放大器(MOPA)源,许多简单的光子集成电路(pic)已经在各种应用领域商业化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technology and application trends of photonic integrated circuits
Research on photonic integrated circuits initially focused on the technical challenges of combining a variety of distinct optical waveguide elements with a minimum of fabrication and epitaxial complexity. The vehicles used to chronicle the progress in this technology have often preceded any real market opportunity, instead hoping to stimulate the development of applications that would rely on dramatic cost-savings that PICs might deliver. With this model, WDM becomes a likely candidate for PIC technology. A number of simple photonic integrated circuits (PICs) are already commercially available in diverse application areas ranging from low-chirp integrated laser-electroabsorption modulator sources to high-power master oscillator-power amplifier (MOPA) sources.
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