用于毫米波无线通信的高性能硅MMIC互连

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819233

Juno Kim, Y. Qian, Guojin Feng, P. Ma, M. Chang, T. Itoh

{"title":"用于毫米波无线通信的高性能硅MMIC互连","authors":"Juno Kim, Y. Qian, Guojin Feng, P. Ma, M. Chang, T. Itoh","doi":"10.1109/EPEP.1999.819233","DOIUrl":null,"url":null,"abstract":"This paper presents the authors' latest efforts to develop high performance interconnects for mixed signal silicon MMICs in the millimeter wave regime. The proposed silicon/metal/polyimide (SIMPOL) interconnect is extremely effective in reducing the crosstalk noise with low insertion loss. Measured results of a prototype test wafer demonstrate 0.33 dB/mm insertion loss at 30 GHz, and excellent noise isolation comparable to background noise over the entire frequency range up to 50 GHz.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"High-performance silicon MMIC interconnect for millimeter wave wireless communication\",\"authors\":\"Juno Kim, Y. Qian, Guojin Feng, P. Ma, M. Chang, T. Itoh\",\"doi\":\"10.1109/EPEP.1999.819233\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the authors' latest efforts to develop high performance interconnects for mixed signal silicon MMICs in the millimeter wave regime. The proposed silicon/metal/polyimide (SIMPOL) interconnect is extremely effective in reducing the crosstalk noise with low insertion loss. Measured results of a prototype test wafer demonstrate 0.33 dB/mm insertion loss at 30 GHz, and excellent noise isolation comparable to background noise over the entire frequency range up to 50 GHz.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819233\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819233","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

本文介绍了作者在毫米波条件下为混合信号硅mmic开发高性能互连的最新努力。所提出的硅/金属/聚酰亚胺(SIMPOL)互连在降低串扰噪声和低插入损耗方面非常有效。原型测试晶片的测量结果表明，在30 GHz时插入损耗为0.33 dB/mm，并且在高达50 GHz的整个频率范围内具有与背景噪声相当的优异噪声隔离性。

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High-performance silicon MMIC interconnect for millimeter wave wireless communication

This paper presents the authors' latest efforts to develop high performance interconnects for mixed signal silicon MMICs in the millimeter wave regime. The proposed silicon/metal/polyimide (SIMPOL) interconnect is extremely effective in reducing the crosstalk noise with low insertion loss. Measured results of a prototype test wafer demonstrate 0.33 dB/mm insertion loss at 30 GHz, and excellent noise isolation comparable to background noise over the entire frequency range up to 50 GHz.

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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