分布式交换机环境下面向面积感知低压的8T-SRAM设计

Y. Morita, H. Fujiwara, Hiroki Noguchi, Y. Iguchi, Koji Nii, H. Kawaguchi, M. Yoshimoto
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引用次数: 159

摘要

本文表明,在未来的高集成SRAM中,8T存储单元可以作为6T存储单元的替代设计,在45纳米工艺中,以后具有较大的阈值电压变化。所提出的电压控制方案提高了写入余量和读电流,并将稳定未选择单元的回写方案应用于8T SRAM。我们验证了在动态电压缩放(DVS)环境下,90 nm 64 mb SRAM在0.42 V下的低压工作是可能的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Area-Conscious Low-Voltage-Oriented 8T-SRAM Design under DVS Environment
This paper demonstrates that an 8T memory cell can be alternative design to a 6T cell in a future highly-integrated SRAM, in a 45-nm process and later with large threshold-voltage variation. The proposed voltage-control scheme that improves a write margin and read current, and the write-back scheme that stabilizes unselected cells are applied to the 8T SRAM. We verified that the low-voltage operation at 0.42 V in a 90-nm 64-Mb SRAM is possible under dynamic voltage scaling (DVS) environment.
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