强辐照DNW MAPS的前端性能和电荷收集特性

L. Ratti, Marco Dellagiovanna, M. Manghisoni, V. Re, G. Traversi, S. Zucca, S. Bettarini, F. Morsani, G. Rizzo
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引用次数: 6

摘要

采用130 nm工艺制造的深n阱(DNW) CMOS单片有源像素传感器(MAPS)暴露在高达约10 Mrad的γ射线中,并进行100°C/168 h的退火循环。通过监测每一步辐照和退火后电荷灵敏度、噪声和电荷收集性能的变化,评估了器件对总电离剂量的耐受性。通过比较不同测试结构对电离辐射的响应,基于单MOS晶体管的辐射诱导退化模型,深入讨论了损伤机制及其与前端结构和传感器特性的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Front-end performance and charge collection properties of heavily irradiated DNW MAPS
Deep N-well (DNW) CMOS monolithic active pixel sensors (MAPS) fabricated in a 130 nm technology have been exposed to γ-rays up to an integrated dose of about 10 Mrad and subjected to a 100 °C/168 h annealing cycle. Device tolerance to total ionizing dose has been evaluated by monitoring the change in charge sensitivity, noise and charge collection properties after each step of the irradiation and annealing campaign. Damage mechanisms and their relation to front-end architecture and sensor features are thoroughly discussed by comparing the response to ionizing radiation of different test structures and based on radiation induced degradation models in single MOS transistors.
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