LED封装与可靠性的关系

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232642

L. Guoguang, Huang Yun, En Yunfei, Yang Shaohua, Lei Zhifeng

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引用次数: 11

摘要

封装是影响LED可靠性的关键因素。本文通过一些失效分析案例，研究了封装工艺不良导致的主要失效模式和机理，并提出了提高LED可靠性的改进方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The relationship between LED package and reliability

Package is a key factor, and affects the reliability of LED. In this paper, the main failure modes and mechanisms that caused by poor package process were investigated through some failure analysis cases, and some improving methods to improve the LED's reliability are put forward.

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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