氧化硅纳米线顶门控场效应器件

Yanfeng Wang, K. Lew, James B. Mattzela, J. Redwing, T. Mayer
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引用次数: 7

摘要

本研究采用气-液-固(VLS)生长法制备了以Au催化剂为原料的Si纳米线,硅气源为10% sih4 (H2),三甲基硼(TMB)为p型掺杂剂,磷化氢(PH3)为n型掺杂剂。TMB或PH3与SiH4的比例在0到10-2之间变化,以调节SiNWs中的空穴或电子载流子浓度。生长后,从生长的SiNWs的尖端去除Au催化剂颗粒,然后使用改进的RCA工艺清洗导线,然后在700℃下干热氧化4小时。透射电镜研究表明,SiNW芯与-10 nm厚的SiO2壳层之间的界面光滑均匀。这些sinw被集成到一个顶部和背门控的测试结构中,通过电流体对齐大面积电极对之间的单个导线。源极和漏极(S/D)触点是通过首先去除NW尖端的氧化壳,然后去除Ti(100nm)/Au(60nm)金属来确定的。然后将由Ti(60nm)/Au(40nm)组成的非自对准3微米长顶栅沉积在作为顶栅介质的SiO2壳上。在n++ Si衬底上涂覆100 nm的LPCVD Si3N4作为后门
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Top-gated field effect devices using oxidized silicon nanowires
The Si nanowires (SiNWs) used in these studies were synthesized by vapor-liquid-solid (VLS) growth from Au catalyst particles using 10% SiH 4 in H2 as the silicon gas source, trimethylboron (TMB) as the p-type dopant, and phosphine (PH3) as the n-type dopant. The ratio of TMB or PH3 to SiH4 was varied from 0 to 10-2 to modulate the hole or electron carrier concentration in the SiNWs. Following growth, the Au catalyst particles were removed from the tips of the as-grown SiNWs, and the wires were cleaned using a modified RCA process prior to dry thermal oxidation at 700degC for 4 hours. Transmission electron microscopy studies show that the interface between the SiNW core and the -10 nm thick SiO2 shell is smooth and uniform. These SiNWs were integrated onto a top- and back-gated test structure by electrofludically aligning individual wires between pairs of large area electrodes. Source and drain (S/D) contacts were defined by first removing the oxide shell at the NW tips and then lifting off Ti(100nm)/Au(60nm) metal. Non-self-aligned 3 mum long top gates comprised of Ti(60nm)/Au(40nm) were then deposited on the SiO2 shell, which served as the top gate dielectric. The n++ Si substrate coated with 100 nm of LPCVD Si3N4 was used as a back gate in these structures
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