基于IPD技术的新型毫米波封装天线阵列

2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Pub Date : 2010-03-01 DOI:10.1109/SMIC.2010.5422965

C. Calvez, C. Person, J. Coupez, F. Gallée, H. Ezzeddine, A. Cathelin, D. Belot

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引用次数: 16

摘要

在毫米波(mmWave)频率范围内，CMOS和BiCMOS技术的最新进展使得将整个RF前端集成在同一芯片上(片上系统(SoC)方法)成为可能。目前的挑战涉及封装内的天线集成(系统在封装(SiP)方法)，这将支持完整的模拟和数字系统。硅上集成天线的增益性能通常不能超过7 dBi(未来标准化的IEEE-802.15.3c使用模型(UM1到UM5)目前预计为14 dBi)。在本文中，我们提出了一种结合玻璃/硅技术的新型天线阵列，适用于毫米波集成封装，并实现无线HDMI(高清多媒体接口)下载应用所需的14 dBi增益值。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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New millimeter wave packaged antenna array on IPD technology

In the millimeter wave (mmWave) frequency range, the recent advances in CMOS and BiCMOS technologies make possible the integration of entire RF front-ends on the same chip (System on Chip (SoC) approach). The present challenge concerns the antenna integration within the packaging (System in Package (SiP) approach) which will support the complete analog and digital system. Integrated antennas on silicon cannot exhibit gain performances greater than 7 dBi, typically, (14 dBi as currently expected by future normalized IEEE-802.15.3c Usage Models (UM1 to UM5)). In this paper, we propose a novel antenna array combining Glass/Silicon technologies, suitable for mmWave integrated packaging and achieving the required 14 dBi gain values for applications such as Wireless HDMI (High-Definition Multimedia Interface) downloading applications.

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来源期刊

2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

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