75um铝细线提升楔形解决方案悬挂中心铅在DPak

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2018-09-01 DOI:10.1109/IEMT.2018.8511750

Jocson Emil Lamco, B. Kahar, W. C. Mun

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引用次数: 0

摘要

引线上凸起的楔块是焊线过程中常见的缺陷模式(如图1所示)。楔形凸起的原因有很多，其中许多原因比较明显，有些原因比较难以识别和解决。本文通过DOE对粘结器电流曲线轨迹、设计布局仿真、弯曲试验和较短的脚楔工具粘结参数等多个输出响应，阐述了良好的夹紧设计和布局的特征，以及产生抬针的根本原因。事实证明，该解决方案能够消除楔形凸起问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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75um Al Thin Wire Lifted Wedge Solutions on Hanging Centre Lead in DPak

Lifted wedge on lead has been the common defect mode (as in Figure 1) encountered in wire bonding process. There are numerous causes for lifted wedge in which many have more obvious causes and some are more eluded to be identified and resolved. This article elaborates on the root causes of lifted stitch, like characterization of a good clamping design and layout through multiple output responses such as bonder current curve traces, design layout simulation, bending test and the shorter foot wedge tool bond parameter through DOE. This solution proved able to eliminate the lifted wedge problem.

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2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

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