Iddq环境下卡接测试集检测桥接故障的有效性

S. Hwang, R. Rajsuman
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引用次数: 4

摘要

近年来,人们已经认识到逻辑测试在检测CMOS电路中的物理缺陷方面效率非常低。大多数物理缺陷被建模为桥接和开放故障,这些故障不能使用卡在故障模型检测。在本研究中,我们检验了Iddq环境中卡滞测试集对桥接故障的检测效率。我们的滞留测试向量是由标准的ATPG程序生成的。在监测电源电流的同时应用这些测试向量。电路中的高电流状态被认为是故障的存在。本研究采用组合电路和顺序电路。结果给出了晶体管内和栅极级桥接故障覆盖率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effectiveness of stuck-at test sets to detect bridging faults in Iddq environment
Recently, it has been recognized that logic testing is very inefficient to detect physical defects in CMOS circuits. Most of the physical defects are modeled as bridging and open faults, which are not detected using a stuck-at fault model. In this study, we examined the detect efficiency of stuck-at test sets for bridging faults in Iddq environment. Our stuck-at test vectors are generated by standard ATPG programs. These test vectors are applied while power supply current is monitored. A high current state in the circuit is considered as a presence of a fault. Sets of combinational and sequential circuits are used in this study. The results are given in terms of intra-transistor and gate-level bridging fault coverages.<>
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