小面积器件中的随机BTI建模及其对SRAM性能的影响

T. Naphade, S. Mahapatra
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引用次数: 1

摘要

开发了一个全面的框架来模拟由于工艺变化和偏置温度不稳定性(BTI)引起的器件级变异性,并研究对SRAM单元等电路的影响。采用随机模拟方法,包括界面陷阱生成的随机反应扩散(RD)模型和预先存在的体积陷阱充电的随机双能井模型,以及简单的指数冲击假设或完整的三维TCAD模拟,来生成阈值电压和阈值电压漂移分布。本文介绍了一种利用阈值电压漂移分布的均值与方差之间的实验关系,从均值紧凑模型生成阈值电压分布的紧凑模型方法。研究了器件级可变性对6T-SRAM单元读写操作的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling of stochastic BTI in small area devices and its impact on SRAM performance
A comprehensive framework is developed to simulate device-level variability due to process variations and Bias Temperature Instability (BTI), and study the impact on circuits such as the SRAM cell. Stochastic simulation approach consisting of the stochastic Reaction Diffusion (RD) model for interface trap generation and stochastic two energy well model for charging of pre-existing bulk traps along with either simple exponential impact assumption or complete 3D TCAD simulation, is used to generate threshold voltage and threshold voltage shift distributions. A compact model approach to generate the threshold voltage distributions from the mean compact model through a procedure that exploits experimental relationship between mean and variance of threshold voltage shift distribution is described. The impact of device-level variability on the 6T-SRAM cell read and write operations is investigated.
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