高温下650V e模GaN器件的电学性能和物理分析

Chi Zhang, Sheng Li, Siyang Liu, Jiaxing Wei, Wangran Wu, Weifeng Sun
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引用次数: 1

摘要

本文研究并比较了商用级联GaN FET和p-GaN HEMT的高温性能。器件结构的差异导致其高温性能差异很大。与级联码器件相比,p-GaN器件在高温下的阈值电压变化较小,但栅极泄漏电流增加较大。此外,高温还会导致动态电参数的不同变化。通过分析模型发现,在p-GaN器件中,电子迁移率的降低主导了开关参数的变化,而在级联码器件中,Vth的降低主导了开关参数的变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical Performances and Physics Based Analysis of 650V E-mode GaN Devices at High Temperatures
High temperature performances of commercial cascode GaN FET and p-GaN HEMT are investigated and compared in this paper. The differences of device structures lead to quite different high temperatures performances. The p-GaN device shows smaller shifts in threshold voltage but larger increase in gate leakage current at high temperatures than cascode device. Moreover, high temperatures also lead to different variations in dynamic electrical parameters. By using analytical models, it is found that the decrease of electron mobility dominates the variations in switching parameters for p-GaN device, however, the decrease of Vth dominates the variations for cascode device.
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