风冷的局限性:现状与挑战

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. Pub Date : 2005-03-15 DOI:10.1109/STHERM.2005.1412167

P. Rodgers, V. Eveloy, Michael Pecht

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引用次数: 37

摘要

尽管人们认为空气冷却已经达到了极限，但本文综述了可以保持该技术有效性的方法。讨论了需要解决的关键热管理领域，包括散热器设计和分析、界面热阻最小化、散热、风扇性能、混合热管理、散热器表面污垢和可持续性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Limits of air-cooling: status and challenges

Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

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Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.

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