通过含有涂层的PCM冷却电子组件

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Pub Date : 2014-11-24 DOI:10.1109/ESTC.2014.6962787

A. Novikov, D. Lexow, M. Nowottnick

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引用次数: 2

摘要

研究了一种利用相变材料(PCM)改善电子元件热管理的新概念。其主要思想是平滑由组件本身或高环境温度产生的温度峰值。这是通过PCM熔化过程中的吸热来实现的。这种材料可以作为粉末形式的添加剂用于标准涂层材料，如树脂，或将直接应用于电子元件并由聚合物材料封装。

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Cooling of electronic assemblies through PCM containing coatings

A novel concept of using phase change materials (PCM) to improve the thermal management of electronic components was investigated. The main idea is the smoothing of temperature peaks produced by the component itself or by high ambient temperature. This was realized by heat absorption during melting process of the PCM. Such materials can be used in powder form as additive to the standard coating material like resin or will be applied directly on the electronic component and encapsulated by a polymer material.

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Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)

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