利用去耦单元和晶体管尺寸提高全加法器电路的软误差鲁棒性

Rafael N. M. Oliveira, F. A. D. Silva, Ricardo Reis, R. Schvittz, C. Meinhardt
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引用次数: 0

摘要

本文评估了镜面和混合全加法器拓扑在标称电压和近阈值电压下的辐射灵敏度。采用7nm ASAP FinFET技术对电路进行了设计和电气仿真。此外,在这些电路中考虑了两种缓解方法:分离单元和晶体管尺寸单独和组合。考虑到软误差,探索晶体管尺寸将$\boldsymbol{3}\mathrm{x}$增加到$\boldsymbol{4}\mathrm{x}$,分别用于标称和近阈值操作。这两种技术都使所研究的FAs电路的总误差发生率降低了35%以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improving Soft Error Robustness of Full Adder Circuits with Decoupling Cell and Transistor Sizing
This paper evaluates the radiation sensitivity of the Mirror and Hybrid Full Adders topologies at nominal and near-threshold voltage. The circuits are designed and electrical simulated adopting the 7 nm ASAP FinFET technology. Also, two mitigation approaches are considered on these circuits: Decoupling Cell and Transistor Sizing individually and combined. Considering soft errors, exploring Transistor Sizing increases $\boldsymbol{3}\mathrm{x}$ to $\boldsymbol{4}\mathrm{x}$ the robustness of the Mirror FA, for nominal and near-threshold operation, respectively. Both techniques reduces the total error occurrence over 35% for the investigated FAs circuits.
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