SiGe HBTs的一维掺杂谱校正

T. Rosenbaum, O. Saxod, V. T. Vu, D. Céli, P. Chevalier, M. Schroter, C. Maneux
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引用次数: 5

摘要

由于微电子技术的小型化和相应的陡峭掺杂曲线,从SIMS测量中获得可靠的结果越来越困难。本文旨在为利用电气参考数据进行TCAD仿真计算未知剖面信息提供指导。相应的程序已应用于SiGe HBTs的测量数据和合成TCAD参考数据。为了获得可靠的一维晶体管测量参考数据,进行了广泛的几何可伸缩参数提取。该方法将一维晶体管的空间电荷区掺杂到与BE和BC电容相关的提取区域。为了调整内部基极掺杂分布,以测量的薄片电阻、零偏压空穴电荷和与面积相关的传递时间为参考。此外,传递电流和归一化跨导对锗轮廓的形状非常敏感,可以作为参考。首先用TCAD数据验证了该方法,然后将其应用于测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Calibration of 1D doping profiles of SiGe HBTs
Due to the miniaturization in microelectronics and corresponding steep doping profiles, it is increasingly difficult to obtain reliable results from SIMS measurements. This paper aims at providing a guideline for calculating unknown profile information by means of TCAD simulations using electrical reference data. The corresponding procedure has been applied to both measurements and synthetic TCAD reference data of SiGe HBTs. An extensive geometry scalable parameter extraction was performed for obtaining reliable measured reference data of the 1D transistor. The methodology modifies the doping of the space charge regions of a 1D transistor to the extracted area related BE and BC capacitances. To adjust the internal base doping profile, measured sheet resistance, zero-bias hole charge, and area related transit time are used as reference. Furthermore, the transfer current and the normalized transconductance are very sensitive to the shape of the Germanium profile and can serve as reference. The methodology was verified with TCAD data first and then applied to measurements.
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