{"title":"3D技术:从概念到产品需要超过3个维度","authors":"B. Swinnen","doi":"10.1109/IITC.2009.5090340","DOIUrl":null,"url":null,"abstract":"Future 3D products are envisioned to be smaller, more performing, more versatile in functionality, less power hungry and less costly than their 2D counterparts. Delivering that promise requires a multi faceted view on the product needs, technology and design requirements, equipment & materials developments and supply chain. This paper discusses the 3D product views and the need for standardization that enables technology roadmapping. The paper also presents an overview of selected 3D technology developments and related challenges to equipment and material needs.","PeriodicalId":301012,"journal":{"name":"2009 IEEE International Interconnect Technology Conference","volume":"99 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"3D technologies: Requiring more than 3 dimensions from concept to product\",\"authors\":\"B. Swinnen\",\"doi\":\"10.1109/IITC.2009.5090340\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Future 3D products are envisioned to be smaller, more performing, more versatile in functionality, less power hungry and less costly than their 2D counterparts. Delivering that promise requires a multi faceted view on the product needs, technology and design requirements, equipment & materials developments and supply chain. This paper discusses the 3D product views and the need for standardization that enables technology roadmapping. The paper also presents an overview of selected 3D technology developments and related challenges to equipment and material needs.\",\"PeriodicalId\":301012,\"journal\":{\"name\":\"2009 IEEE International Interconnect Technology Conference\",\"volume\":\"99 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2009.5090340\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2009.5090340","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D technologies: Requiring more than 3 dimensions from concept to product
Future 3D products are envisioned to be smaller, more performing, more versatile in functionality, less power hungry and less costly than their 2D counterparts. Delivering that promise requires a multi faceted view on the product needs, technology and design requirements, equipment & materials developments and supply chain. This paper discusses the 3D product views and the need for standardization that enables technology roadmapping. The paper also presents an overview of selected 3D technology developments and related challenges to equipment and material needs.
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