基于多物理场仿真的大功率LED封装线键疲劳失效建模

Kai Chen, Jiajie Fan, C. Qian, Bin Tang, Xuejun Fan, Guoqi Zhang
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引用次数: 1

摘要

如今,大功率LED封装以其效率高、使用寿命长、体积小等优点被广泛应用于许多领域。LED封装由许多不同的组件组成,这些组件由不同的材料制成,在不同的条件下工作。因此,每个组件对LED封装的可靠性问题都有自己的影响模式,如芯片故障、封装故障、互连故障等。在这些故障中,作为互连工作的线键的疲劳失效是一个常见但严重的问题,它将导致LED封装的灾难性故障。因此,开发一种准确预测线键疲劳寿命的方法已成为LED制造和研究人员关注的焦点。本文利用ANSYS Multiphysics模块对大功率LED封装在不同电流驱动下的热力学应力分布进行了热力学有限元仿真。然后根据半经验疲劳模型估计出平均失效周期。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fatigue failure modeling of wire bonds of high power LED packages with a multiphysics simulation method
Today, high-power LED packages have been widely used in many fields by virtue of its high efficiency, long service life and small size etc. A LED package consists of many different components, which are made of different materials being operated under different conditions. As a result, each component has its own pattern of impact on the reliability problem of LED packages, such as chip failure, package failure, and interconnection failure and so on. Among these failures, the fatigue failure of wire bonds those work as the interconnection is a common but severe issue that will cause a catastrophic failure of the LED package. Therefore developing a precise prediction method for the fatigue lifetime of the wire bonds has attracted many attentions of LED manufacturers and researchers. In this paper, the thermal, mechanical stress distributions on a high power LED package driven by different currents were simulated from a thermal-mechanical finite element simulation with the ANSYS Multiphysics module. Then the mean cycles to failure could be estimated based on the semi-empirical fatigue model.
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