SOI和Bulk pFinFET模拟性能比较

A. Oliveira, P. Agopian, E. Simoen, C. Claeys, J. Martino
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引用次数: 2

摘要

本文对基于绝缘体上硅(SOI)基片的三栅极pMOSFET器件的模拟性能进行了实验比较。这种比较是基于漏极电流、亚阈值摆幅、跨导过漏极电流比、早期电压、固有电压增益以及最后的单位增益频率进行的。与Bulk器件相比,SOI器件在几乎所有研究尺寸上都表现出优越的模拟性能,除了通道长度短和翅片宽度宽,其中反向寄生传导降低了所有分析参数。此外,由于在Bulk器件的沟道区域下存在掺杂注入,使得该区域内的任何泄漏都变得不那么容易发生。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of analog performance between SOI and Bulk pFinFET
This paper presents an experimental comparison of the analog performance between triple gate pMOSFET devices constructed on Silicon-On-Insulator (SOI) and Bulk substrates. This comparison was performed based on the drain current, subthreshold swing, transconductance over drain current ratio, Early voltage, intrinsic voltage gain and, finally, unit gain frequency. The SOI devices presented a superior analog behavior compared to the Bulk ones for almost all studied dimensions, except for the short channel length and wide fin width, where the back parasitic conduction degraded all the analyzed parameters. Furthermore, due to the existence of the doping implantation under the channel region in the Bulk devices, it became less susceptible to any leakage in this region.
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