谁在整个设计过程中真正负责质量?

Ron Wilson, D. Overhauser
{"title":"谁在整个设计过程中真正负责质量?","authors":"Ron Wilson, D. Overhauser","doi":"10.1109/ISQED.2006.146","DOIUrl":null,"url":null,"abstract":"From development through manufacturing an IP core undergoes many different stages that can affect the overall quality and characteristics of the core. When a project is slowed or halted because of a problem with the IP core then who is responsible? Is it the IP provider who provided a core that worked at delivery, the integrator that made changes as necessary or perhaps the manufacturer? This panel will explore the many possible causes of problems with an IP core, but more importantly it will examine what is being done to minimize the risk associated with third party IP and who is responsible.","PeriodicalId":302936,"journal":{"name":"IEEE International Symposium on Quality Electronic Design","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Who is really responsible for quality throughout the design process?\",\"authors\":\"Ron Wilson, D. Overhauser\",\"doi\":\"10.1109/ISQED.2006.146\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"From development through manufacturing an IP core undergoes many different stages that can affect the overall quality and characteristics of the core. When a project is slowed or halted because of a problem with the IP core then who is responsible? Is it the IP provider who provided a core that worked at delivery, the integrator that made changes as necessary or perhaps the manufacturer? This panel will explore the many possible causes of problems with an IP core, but more importantly it will examine what is being done to minimize the risk associated with third party IP and who is responsible.\",\"PeriodicalId\":302936,\"journal\":{\"name\":\"IEEE International Symposium on Quality Electronic Design\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-03-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Symposium on Quality Electronic Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2006.146\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2006.146","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

从开发到制造,IP核要经历许多不同的阶段,这些阶段会影响到核的整体质量和特性。当一个项目因为IP核问题而被拖慢或停止时,谁该对此负责?是提供交付时工作的核心的IP提供商,还是根据需要进行更改的集成商,或者可能是制造商?该小组将探讨IP核问题的许多可能原因,但更重要的是,它将检查正在采取哪些措施来最大限度地减少与第三方IP相关的风险以及谁应该对此负责。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Who is really responsible for quality throughout the design process?
From development through manufacturing an IP core undergoes many different stages that can affect the overall quality and characteristics of the core. When a project is slowed or halted because of a problem with the IP core then who is responsible? Is it the IP provider who provided a core that worked at delivery, the integrator that made changes as necessary or perhaps the manufacturer? This panel will explore the many possible causes of problems with an IP core, but more importantly it will examine what is being done to minimize the risk associated with third party IP and who is responsible.
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