印刷电路板实时检测系统

ISIE 2001. 2001 IEEE International Symposium on Industrial Electronics Proceedings (Cat. No.01TH8570) Pub Date : 2001-06-12 DOI:10.1109/ISIE.2001.931775

Kang-Sun Choi, Jae-Young Pyun, Nam-Hyeong Kim, Byeong-Doo Choi, S. Ko

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引用次数: 29

摘要

本文提出的PCB检测系统可以检测出线材断裂和短路等缺陷，与现有技术相比，检测速度明显加快。所提出的检测方法是基于存储的参考图像与测试(观察)图像之间的参考匹配。为了解决参照匹配中的不对齐问题，进行了块匹配。为了降低计算复杂度，我们使用单指令多数据(SIMD)指令来实现所提出的算法，即SSE2。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Real-time inspection system for printed circuit boards

The PCB inspection system presented in this paper can detect defects including the breaks in the wires and short circuit and is significantly faster when compared to the existing techniques. The proposed inspection method is based on referential matching between the stored reference image and the test (observed) image. Block matching is performed to solve the misalignment in referential matching. In order to reduce the computational complexity, we implement the proposed algorithm using the single instruction multiple data (SIMD) instructions, so called SSE2.

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来源期刊

ISIE 2001. 2001 IEEE International Symposium on Industrial Electronics Proceedings (Cat. No.01TH8570)

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