射频集成电路中存在带内干扰时无线通信性能的基于测量的诊断

M. Nagata, S. Shimazaki, N. Azuma, Shin-ichiro Takahashi, M. Murakami, K. Hori, S. Tanaka, M. Yamaguchi
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引用次数: 3

摘要

无线通信信道中的带内干扰是由于单芯片解决方案中基带数字信号处理所使用的多个时钟频率的高次谐波造成的。通过对LTE兼容系统的硬件在环仿真(HILS),探讨了带内杂散对无线性能的影响。HILS采用65nm CMOS技术制造射频接收器电路,将前端电路级交互和后端系统级数字信号处理相结合。实验显示了LTE通信吞吐量对基片耦合噪声的敏感性,从数字噪声模拟器到同一芯片上的射频接收器电路。通过有意地将输入参考RF正弦噪声分量添加到具有LTE调制的输入RF信号中,等效地确认所观察到的响应。HILS能够对无线通信系统进行分层诊断,从电路级交互到系统级对噪声耦合的响应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Measurement-based diagnosis of wireless communication performance in the presence of in-band interferers in RF ICs
In-band interferers in wireless communication channels are due to the high order harmonics of multiple clock frequencies used by baseband digital signal processing in a single-chip solution. The impacts of in-band spurious tones on wireless performance are explored with hardware-in-the-loop simulation (HILS) of the LTE compliant systems. RF receiver circuits fabricated in a 65 nm CMOS technology are involved in the HILS, for combining circuit-level interactions at the front end and system-level digital signal processing in the back end. Experiments exhibit the sensitivity of LTE communication throughput against substrate coupling noise from a digital noise emulator to the RF receiver circuits on the same chip. The observed response is equivalently confirmed with the input referred RF sinusoidal noise components intentionally added to the input RF signal with LTE modulation. The HILS enables hierarchical diagnosis of a wireless communication system from circuit-level interactions to system-level responses against noise coupling.
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