翅片宽度变化对圆角锥形16 nm finfet性能的影响

S. Hatta, N. Soin, S. H. Abdul Rahman, Y. A. Wahab, H. Hussin
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引用次数: 15

摘要

CMOS技术的快速扩展使得人们开始从传统的平面mosfet转向FinFET架构,特别是在22nm和14nm技术节点上。finfet技术确保低功耗和更好的面积利用率,以及传统的缩放改进。观察到,对于finfet,翅片宽度越小,特性越好。我们观察到,NFinFET和PFinFET在线性和饱和状态下的漏极电流特性会随着翅片宽度的减小而减小。离子/离合比一般随翅片宽度的增加而减小。当翅片宽度从5nm变化到15nm时,NFinFET的离子/离合率显著下降至近50%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of the fin width variation on the performance of 16 nm FinFETs with round fin corners and tapered fin shape
The rapid scaling of the CMOS technology is causing the evaluation from conventional planar MOSFETs to the FinFET architecture, particularly in the 22 nm and 14 nm technology nodes. FinFETs technologies ensure low power usage and better area utilization, as well as traditional scaling improvements. It was observed that for FinFETs, the smaller the width of the fin, the better the characteristics. It was observed that drain current characteristics of the NFinFET and PFinFET at both the linear and saturation regime would decrease in magnitude as the width of the fin was decreased. The Ion/Ioff ratio generally decreases as the width of the fin increases. The NFinFET particularly exhibits a significant drop in the Ion/Ioff of to nearly 50% for a change of fin width from 5nm to 15nm.
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