{"title":"耦合分析及等效电路模型的集成电路带状线方法","authors":"JongTae Hwang, Wonjoo Jung, Soyoung Kim","doi":"10.1109/APEMC.2015.7175299","DOIUrl":null,"url":null,"abstract":"As portable electronic devices are widely used in wireless communication, analysis of RF interference becomes an essential step for IC designers. In order to test electromagnetic compatibility (EMC) of IC operating at high frequencies, IC stripline method is proposed in IEC standard. This method can be applied up to 3 GHz and covers the testing of ICs and small component. This paper represents simulation results of the open version of IC stripline in 3D EM solver. Also, the coupling effect of IC stripline method is analyzed with S-parameter results. The distributed lumped-element equivalent model is presented for explaining coupling relation between IC stripline and package. This model can be used for quick analysis for EMC of ICs.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Coupling analysis and equivalent circuit model of the IC stripline method\",\"authors\":\"JongTae Hwang, Wonjoo Jung, Soyoung Kim\",\"doi\":\"10.1109/APEMC.2015.7175299\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As portable electronic devices are widely used in wireless communication, analysis of RF interference becomes an essential step for IC designers. In order to test electromagnetic compatibility (EMC) of IC operating at high frequencies, IC stripline method is proposed in IEC standard. This method can be applied up to 3 GHz and covers the testing of ICs and small component. This paper represents simulation results of the open version of IC stripline in 3D EM solver. Also, the coupling effect of IC stripline method is analyzed with S-parameter results. The distributed lumped-element equivalent model is presented for explaining coupling relation between IC stripline and package. This model can be used for quick analysis for EMC of ICs.\",\"PeriodicalId\":325138,\"journal\":{\"name\":\"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEMC.2015.7175299\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEMC.2015.7175299","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Coupling analysis and equivalent circuit model of the IC stripline method
As portable electronic devices are widely used in wireless communication, analysis of RF interference becomes an essential step for IC designers. In order to test electromagnetic compatibility (EMC) of IC operating at high frequencies, IC stripline method is proposed in IEC standard. This method can be applied up to 3 GHz and covers the testing of ICs and small component. This paper represents simulation results of the open version of IC stripline in 3D EM solver. Also, the coupling effect of IC stripline method is analyzed with S-parameter results. The distributed lumped-element equivalent model is presented for explaining coupling relation between IC stripline and package. This model can be used for quick analysis for EMC of ICs.
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