InP-InGaAs、InGaP-GaAs和SiGe hbt的小信号本征基极电阻效应

Yo‐Sheng Lin, Hsiao-Bin Liang, Chi-Chen Chen, Jia-lun Chen, Shey-Shi Lu
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引用次数: 1

摘要

本文首次全面分析了小信号固有基电阻(Rbin)对InP-InGaAs (Gao et al., 2004)、InGaP-GaAs (Bousnina et al., 2004)和SiGe hbt射频性能的影响。结果表明,等效输入阻抗实部(Re(Zin))和等效输出阻抗实部(Re(Zout))均随着本禀基极电阻Rbin的增大而增大。因此,R bin的增加(即减少基底掺杂、基底宽度和基底接触侧基底边缘长度)会使这些HBTs的散射参数S11和S22的扭结现象更加明显(Lu et al., 2001)。这些现象可以用我们推导出的Zin和zout在低频和高频下的完整表达式来很好地解释。此外,对于相对较小的Rbin,发现在恒定的集电极-发射极电压(VCE)下,基极电流的增加(对应于基极-发射极电阻(rpi)的降低和跨导(gm)的增加)增强了异常倾角。而对于相对较大的Rbin,在VCE不变的情况下,基极电流的增加掩盖了异常倾角。这些现象也可以用我们提出的理论来解释
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Small-signal intrinsic base resistance effect on InP-InGaAs, InGaP-GaAs and SiGe HBTs
In this paper, a comprehensive analysis of the effect of small-signal intrinsic base resistance (Rbin) on the RF performances of InP-InGaAs (Gao et al., 2004), InGaP-GaAs (Bousnina et al., 2004), and SiGe HBTs are demonstrated for the first time. It was found that for these HBTs, both the real part of the equivalent input impedance (Re(Zin)) and the real part of the equivalent output impedance (Re(Zout)) increase with the increase of the intrinsic base resistance Rbin. Therefore, an increase of R bin (i.e. reducing the base doping, the base width, and the base edge length in the base contact side) makes the kink phenomena of both the scattering parameter S11 and S22 of these HBTs more obvious (Lu et al., 2001). These phenomena can be explained perfectly by our derived complete expressions of Zin and Z out at low and high frequencies. In addition, for relatively smaller Rbin, it was found that under constant collector-emitter voltage (VCE), an increase of base current (which corresponds to a decrease of base-emitter resistance (rpi ) and an increase of trans-conductance (gm)) enhances the anomalous dip. While for relatively larger Rbin, it was found that under constant VCE, an increase of base current obscures the anomalous dip. These phenomena can also be explained by our proposed theory
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