印制板制造中的表面处理

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298788

K. Song, J. Liu

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引用次数: 1

摘要

随着表面贴装元件密度的提高，球栅阵列封装(BGA)得到了越来越广泛的应用。对印刷线路板(PWB)表面光洁度要求的提高是当前制造工艺中更为重要的因素。在本文中，我们介绍了目前最先进的饰面技术，并讨论了它们的优缺点。此外，我们还展示了一些相关的失败案例，为上述主张提供了有力的支持。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Surface finishes in PWB fabrication

With the density of surface mount components increasing, ball grid array packaging (BGA) has become used more widely. The increased requirements on surface finish of printed wiring boards (PWB) turns out to be an even more important factor in current fabrication processes. In this paper, we introduced state of the art predominant finishes technologies and discussed their pros and cons. In addition, we show some related failure cases, which provide strong support for the above claim.

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来源期刊

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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