{"title":"模拟传输介质对电源诱发抖动的影响","authors":"J. N. Tripathi, R. Achar","doi":"10.1109/EDAPS.2017.8277020","DOIUrl":null,"url":null,"abstract":"In this paper, a method is presented to estimate the effect of transmission media on power supply induced jitter for a voltage-mode driver circuit. Transmission media is represented via its equivalent models of transmission lines while calculating the power supply induced jitter. The proposed semi-analytical method for jitter analysis is compared against the conventional simulations (commercial tools) in a 55nm technology of STMicroelectronics. A reasonable matching is reported.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Modeling the effects of transmission media on power supply induced jitter\",\"authors\":\"J. N. Tripathi, R. Achar\",\"doi\":\"10.1109/EDAPS.2017.8277020\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a method is presented to estimate the effect of transmission media on power supply induced jitter for a voltage-mode driver circuit. Transmission media is represented via its equivalent models of transmission lines while calculating the power supply induced jitter. The proposed semi-analytical method for jitter analysis is compared against the conventional simulations (commercial tools) in a 55nm technology of STMicroelectronics. A reasonable matching is reported.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8277020\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277020","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling the effects of transmission media on power supply induced jitter
In this paper, a method is presented to estimate the effect of transmission media on power supply induced jitter for a voltage-mode driver circuit. Transmission media is represented via its equivalent models of transmission lines while calculating the power supply induced jitter. The proposed semi-analytical method for jitter analysis is compared against the conventional simulations (commercial tools) in a 55nm technology of STMicroelectronics. A reasonable matching is reported.