硅厚度对传统无结场效应晶体管性能的影响

M. Agarwal, V. Narula
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引用次数: 0

摘要

利用TCAD仿真研究了n型双栅无结场效应晶体管(JLFET)在不同硅厚度下的性能。器件的性能高度依赖于硅的厚度。在6nm ~ 12nm硅厚范围内,研究了导通电流、关断电流、开/关电流比、亚阈值斜率(SS)和阈值电压等参数。仿真结果表明,随着硅厚度的增加,器件性能有所下降。当硅厚度为6nm时,获得了最佳的性能参数。本文还论证了栅极功函数与硅厚度之间的关系,以获得更好的器件性能。此外,在增加栅极材料的功函数的情况下,即使增加硅的厚度,性能参数也有所改善。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of silicon thickness on the performance of conventional junctionless field effect transistor
The performance of N-type double gate junctionless Field Effect Transistor(JLFET) at different silicon thickness is studied using TCAD simulations. The performance of the device is highly dependent on silicon thickness. The different parameters like ON current, OFF current, ON/OFF current ratio, Subthreshold Slope(SS) and threshold Voltage has been studied at different silicon thickness varied from 6nm to 12nm. It is observed from the simulations that with the increase in silicon thickness the device performance has degraded. The best performance parameters are obtained when the silicon thickness is 6nm. This paper also demonstrates the correlation between the gate work function and the silicon thickness for better device performance. Further, an improvement in the performance parameters even on increasing the silicon thickness has been observed on increasing the work function of the gate material.
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