可靠的系统包层分配

ASP-DAC 2004: Asia and South Pacific Design Automation Conference 2004 (IEEE Cat. No.04EX753) Pub Date : 2004-01-27 DOI:10.1109/ASPDAC.2004.1337535

J. Minz, S. Lim

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引用次数: 6

摘要

新兴的混合信号封装系统(SOP)技术的布线环境比传统的PCB或MCM技术更先进-引脚位于SOP封装基板的所有层，而不是仅位于最顶层。我们提出了一种新的以互连为中心的层分配算法LA-SOP，它可以处理任意路由拓扑并产生接近最优的结果。这项工作的贡献有三个方面:(i) SOP路由资源的建模，(ii)新的SOP层分配问题的制定，以及(iii)开发一种快速而新颖的算法，该算法考虑了SOP独有的各种设计约束。我们回顾了PCB、IC和MCM算法的各种方法，并研究了它们对SOP模型的适用性。实验结果证明了该算法的有效性。

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Layer assignment for reliable system-on-package

The routing environment for the new emerging mixed-signal system-on-package (SOP) technology is more advanced than that of the conventional PCB or MCM technology - pins are located at all layers of SOP packaging substrate rather than the top-most layer only. We propose a new interconnect-centric layer assignment algorithm named LA-SOP that handles arbitrary routing topologies and produces near optimal results. The contribution of this work is threefold: (i) modeling of the SOP routing resource, (ii) formulation of the new SOP layer assignment problem, and (iii) development of a fast and novel algorithm that considers the various design constraints unique to SOP. We review various approaches for the PCB, IC and MCM algorithms and investigate their applicability to the SOP model. Our related experimental results demonstrate the effectiveness of our algorithm LA-SOP.

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ASP-DAC 2004: Asia and South Pacific Design Automation Conference 2004 (IEEE Cat. No.04EX753)

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