MgO介电层的软击穿

E. Miranda, E. O'Connor, G. Hughes, P. Casey, K. Cherkaoui, S. Monaghan, R. Long, D. O'Connell, P. Hurley
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引用次数: 11

摘要

在这项工作中,我们报道了在硅衬底上生长的20nm厚氧化镁(MgO)薄膜的软击穿(SBD)失效模式的发生。据我们所知,这是在具有如此大氧化物厚度的高κ栅电介质中首次观察到这种失效机制。我们表明,在较宽的电压范围内,I-V特性遵循典型的SBD传导的幂律依赖性,而不是SiO2的幂律依赖性。我们特别关注了电流大小与归一化差分电导之间的关系,并分析了注入极性和衬底类型对电流大小的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Soft breakdown in MgO dielectric layers
In this work, we report on the occurrence of the soft breakdown (SBD) failure mode in 20nm-thick films of magnesium oxide (MgO) grown on Si substrates. To our knowledge, this is the first observation of this failure mechanism in a high-κ gate dielectric with such a large oxide thickness. We show that the I–V characteristics follow the power-law dependence typical of SBD conduction in a wider voltage range than that reported for SiO2. We pay special attention to the relationship between the magnitude of the current and the normalized differential conductance, and analyze the role played by the injection polarity and substrate type.
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