{"title":"MEMS晶圆级封装技术","authors":"A. Mirza","doi":"10.1109/ITHERM.2000.866816","DOIUrl":null,"url":null,"abstract":"This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding can provide not only basic MEMS device functionality, but also first-level assembly or packaging solutions for many MEMS devices. Numerous examples of high-volume production applications for wafer-level bonding will be described.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"30","resultStr":"{\"title\":\"Wafer-level packaging technology for MEMS\",\"authors\":\"A. Mirza\",\"doi\":\"10.1109/ITHERM.2000.866816\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding can provide not only basic MEMS device functionality, but also first-level assembly or packaging solutions for many MEMS devices. Numerous examples of high-volume production applications for wafer-level bonding will be described.\",\"PeriodicalId\":201262,\"journal\":{\"name\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"30\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2000.866816\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2000.866816","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding can provide not only basic MEMS device functionality, but also first-level assembly or packaging solutions for many MEMS devices. Numerous examples of high-volume production applications for wafer-level bonding will be described.