IC制造选项打破成本/性能瓶颈

C. Case
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引用次数: 0

摘要

仅给出摘要形式,如下。到2000年,集成电路产业预计将增长到2730亿美元,同期全球电子产品产量将达到1万亿美元,作者讨论了将维持这种增长的宏观经济和人口趋势。应用程序、机会驱动因素和生产都按地区进行了讨论。半导体行业协会的国家半导体技术路线图预测,到2010年将出现1ghz / 14cm /sup /芯片;为了满足成本/性能方面的挑战,使行业保持在这一路线图上,部分负担落在了IC后端互连上。增加的复杂性支持这些IC的增强性能来自额外的布线水平,更大的互连密度和总互连长度。作者探讨了这些复杂性问题以及性能和功能之间的经济权衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
IC manufacturing options to break the cost/performance bottleneck
Summary form only given, as follows. With the IC industry projected to grow to $273 billion by the year 2000 and worldwide electronic production to $1 trillion in the same period, the author discusses the macroeconomics and demographic trends that will sustain this growth. Applications, opportunity drivers and production are all discussed, by region. The Semiconductor Industry Association's National Technology Roadmap for Semiconductor forecasts 1 GHz 14 cm/sup 2/ chips by the year 2010; part of burden in meeting the cost/performance challenges to keep the industry on this roadmap falls on the IC back-end interconnection. The increased complexity supporting enhanced performance of the these IC's comes from additional wiring levels, greater interconnect density and the total interconnect length. The author explores these complexity issues and the economic trade-off between performance and functionality.
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