{"title":"微通道流动中的传热[基板冷却]","authors":"W. Chu, U.T. Hsu, M. Wong, Y. Zohar","doi":"10.1109/HKEDM.1994.395134","DOIUrl":null,"url":null,"abstract":"The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented.<<ETX>>","PeriodicalId":206109,"journal":{"name":"1994 IEEE Hong Kong Electron Devices Meeting","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Heat transfer in a microchannel flow [substrate cooling]\",\"authors\":\"W. Chu, U.T. Hsu, M. Wong, Y. Zohar\",\"doi\":\"10.1109/HKEDM.1994.395134\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented.<<ETX>>\",\"PeriodicalId\":206109,\"journal\":{\"name\":\"1994 IEEE Hong Kong Electron Devices Meeting\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 IEEE Hong Kong Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HKEDM.1994.395134\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 IEEE Hong Kong Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HKEDM.1994.395134","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Heat transfer in a microchannel flow [substrate cooling]
The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented.<>
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