高频数字互连用铜厚膜的评价

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75946

E. Beyne, J. Roggen, R. Mertens

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引用次数: 1

摘要

对铜厚膜多层技术在比特率高达600mb /s的系统中用作高频数字互连进行了评估。为了帮助设计互连，开发并描述了用于计算任何二维几何形状的电气参数和性能的软件工具。分析是基于准静态方法。实现了一种具有高带宽和50 ω阻抗的厚膜多层测试结构。计算得到的线路参数与实测值吻合较好

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Evaluation of copper thick film for high frequency digital interconnection

Copper thick-film multilayer technology is evaluated for use as a high-frequency digital interconnect in systems with bit rates up to 600 Mb/s. To help design the interconnect, software tools which calculate the electrical parameters and performance for any two-dimensional geometry were developed and are described. The analysis is based on a quasistatic method. A thick-film multilayer test structure with high bandwidth and 50- Omega impedance was realized. The calculated line parameters show good agreement with the measured values.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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