I. Takaki, Y. Takada, M. Itagaki, S. Mukaigawa, T. Fujiwara, S. Ohshima, K. Oyama, I. Takahashi, T. Kuwashima
{"title":"使用爆炸性层间金属箔的陶瓷连接紧凑系统","authors":"I. Takaki, Y. Takada, M. Itagaki, S. Mukaigawa, T. Fujiwara, S. Ohshima, K. Oyama, I. Takahashi, T. Kuwashima","doi":"10.1109/MODSYM.2002.1189542","DOIUrl":null,"url":null,"abstract":"A capacitor discharge joining technique used to fabricate alumina (Al/sub 2/O/sub 3/) tile-titanium foil-Al/sub 2/O/sub 3/ tile joint was investigated to optimize the energy injected into the foil. The large current was supplied to the foil sandwiched with Al/sub 2/O/sub 3/ tiles using storage capacitor which was charged up to several kVs. The Al/sub 2/O/sub 3/ tiles were successfully bonded when the charged voltage in the capacitor was same value with the energy required for vaporization of the titanium foils. The bonding strength increases with energy input to the foil. The bonding also increases from 600 to 1250 N shear strength with increasing compression stress on the Al/sub 2/O/sub 3/ tiles from 1.1 to 4.2 MPa at use of 5 mm width titanium foil as the interlayer. An investigation of the interfacial structure of the joints using electron probe micro-analysis revealed that distinct reaction areas existed in the interlayers.","PeriodicalId":339166,"journal":{"name":"Conference Record of the Twenty-Fifth International Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop.","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Compact system for ceramics joining using explosive interlayer metal foil\",\"authors\":\"I. Takaki, Y. Takada, M. Itagaki, S. Mukaigawa, T. Fujiwara, S. Ohshima, K. Oyama, I. Takahashi, T. Kuwashima\",\"doi\":\"10.1109/MODSYM.2002.1189542\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A capacitor discharge joining technique used to fabricate alumina (Al/sub 2/O/sub 3/) tile-titanium foil-Al/sub 2/O/sub 3/ tile joint was investigated to optimize the energy injected into the foil. The large current was supplied to the foil sandwiched with Al/sub 2/O/sub 3/ tiles using storage capacitor which was charged up to several kVs. The Al/sub 2/O/sub 3/ tiles were successfully bonded when the charged voltage in the capacitor was same value with the energy required for vaporization of the titanium foils. The bonding strength increases with energy input to the foil. The bonding also increases from 600 to 1250 N shear strength with increasing compression stress on the Al/sub 2/O/sub 3/ tiles from 1.1 to 4.2 MPa at use of 5 mm width titanium foil as the interlayer. An investigation of the interfacial structure of the joints using electron probe micro-analysis revealed that distinct reaction areas existed in the interlayers.\",\"PeriodicalId\":339166,\"journal\":{\"name\":\"Conference Record of the Twenty-Fifth International Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop.\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-06-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Record of the Twenty-Fifth International Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MODSYM.2002.1189542\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the Twenty-Fifth International Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MODSYM.2002.1189542","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Compact system for ceramics joining using explosive interlayer metal foil
A capacitor discharge joining technique used to fabricate alumina (Al/sub 2/O/sub 3/) tile-titanium foil-Al/sub 2/O/sub 3/ tile joint was investigated to optimize the energy injected into the foil. The large current was supplied to the foil sandwiched with Al/sub 2/O/sub 3/ tiles using storage capacitor which was charged up to several kVs. The Al/sub 2/O/sub 3/ tiles were successfully bonded when the charged voltage in the capacitor was same value with the energy required for vaporization of the titanium foils. The bonding strength increases with energy input to the foil. The bonding also increases from 600 to 1250 N shear strength with increasing compression stress on the Al/sub 2/O/sub 3/ tiles from 1.1 to 4.2 MPa at use of 5 mm width titanium foil as the interlayer. An investigation of the interfacial structure of the joints using electron probe micro-analysis revealed that distinct reaction areas existed in the interlayers.