{"title":"制造在21世纪的新概念为300毫米晶圆厂","authors":"A. Koike","doi":"10.1109/VLSIT.2001.934918","DOIUrl":null,"url":null,"abstract":"Trecenti Technologies, Inc. is currently creating the first 300 mm-wafer volume production fab. Our basic objectives are to minimize cycle time with all single-wafer processes and to create a scalable fab that has an optimized expansion unit to satisfy high investment efficiency and flexibility to changing market needs.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Manufacturing in the 21st century-new concept for 300 mm fab\",\"authors\":\"A. Koike\",\"doi\":\"10.1109/VLSIT.2001.934918\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Trecenti Technologies, Inc. is currently creating the first 300 mm-wafer volume production fab. Our basic objectives are to minimize cycle time with all single-wafer processes and to create a scalable fab that has an optimized expansion unit to satisfy high investment efficiency and flexibility to changing market needs.\",\"PeriodicalId\":232773,\"journal\":{\"name\":\"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-06-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.2001.934918\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2001.934918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Manufacturing in the 21st century-new concept for 300 mm fab
Trecenti Technologies, Inc. is currently creating the first 300 mm-wafer volume production fab. Our basic objectives are to minimize cycle time with all single-wafer processes and to create a scalable fab that has an optimized expansion unit to satisfy high investment efficiency and flexibility to changing market needs.