由于单元串扰导致的SRAM单元可靠性下降

Jongsun Bae, S. Baeg, S. Wen, R. Wong
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引用次数: 1

摘要

相邻SRAM单元之间的电容由于缺陷可以增加较小的几何技术。然而,SRAM中由这种缺陷电容引起的异常行为往往被忽视,并可能导致NTF(无故障发现)故障。在当今的制造业中,由于缺陷而产生的这种电容的有效测试或校准方法并不容易获得。本文采用三维场求解法求解缺陷电容的电位范围。通过耦合电容的串扰交流电流,被称为单元耦合电容(CCCP),被建模为电流源,以建立改进的SNM(静态噪声裕度)。SNM和VDDMIN两个指标表明,CCCP下的可靠性在内存操作过程中会显著下降。即使具有边际CCCP,在65nm SRAM单元中,读操作时SNM变化为40mV,写操作时VDDMIN移位为110mV。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SRAM cell reliability degradations due to cell crosstalk
The capacitance between adjacent SRAM cells due to defectivity can increase in smaller geometry technologies. However, the abnormal behaviors due to such defective capacitance in SRAM are often neglected and can cause NTF (No Trouble Found) failures. The effective testing or calibration methods for such capacitance due to defects are not easily available in today's manufacturing. In this paper, a 3-D field solver was used to see the potential ranges of the defective capacitance. The crosstalk AC current through the coupling capacitance, which is referred to as cell coupling capacitor (CCCP) is newly modeled as a current source to build modified SNM (Static Noise Margin). The two metrics, SNM and VDDMIN show that the reliability under the CCCP can be significantly degraded during memory operations. Even with a marginal CCCP, SNM variation is 40mV at a read operation and VDDMIN shift is 110mV at a write operation in a 65nm SRAM cell.
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