Short localization in a multi chip BGA package

Magnetic Current Imaging (MCI) has been used for more than a decade to localize shorts and leakages in packages non-destructively. Now that packages are becoming more complex with multiple dies inside the same package, MCI is showing its effectiveness in localizing these complicated shorts non-destructively when the Failure Analysis (FA) engineer does not know from Automated Test Equipment (ATE) if the fault location is in the die or package or which die. We show in this paper that the FA lab can be simplified by the introduction of MCI as a one stop Fault Isolation (FI) tool for all shorts and leakages.