Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - 最新文献

Structure and composition of the Cu/low k interconnects de-layered with FIB

Pub Date : 2014-09-18 DOI: 10.1109/IPFA.2014.6898162 D. Wang, P. K. Tan, Maggie Yamin Huang, J. Lam, Z. Mai

ATR-FTIR, DUAL BEAM FIB-SEM, TEM and TOF-SIMS studies on high temperature and moisture induced “white haze” following the pattern of electrodes in touch panels

Pub Date : 2014-09-18 DOI: 10.1109/IPFA.2014.6898153 Chen Yixin, Hao Meng, Shao Jingjing, L. Esther, Khoo Bing Sheng, Chooi Meailing, Li Kai, Xing Qiuju, Kon Cambridge, Lee Hwang Sheng, Shen Yiqiang, Song Lu, Xing Zhenxiang, Zhou Yongkai, Feng Yang, Fu Chao, H. Younan, Li Xiaomin

Localized FIB delayering on advanced process technologies

Pub Date : 2014-09-18 DOI: 10.1109/IPFA.2014.6898144 D. Donnet, O. Sidorov, P. Carleson, C. Rue, R. Alvis, S. Madala

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