{"title":"采用半定制工艺设计和制造宽温度范围应用的三轴加速度计传感器微系统","authors":"A. Merdassi, Y. Wang, G. Xereas, V. Chodavarapu","doi":"10.1117/12.2037344","DOIUrl":null,"url":null,"abstract":"This paper describes an integrated CMOS-MEMS inertial sensor microsystem, consisting of a 3-axis accelerometer sensor device and its complementary readout circuit, which is designed to operate over a wide temperature range from - 55°C to 175°C. The accelerometer device is based on capacitive transduction and is fabricated using PolyMUMPS, which is a commercial process available from MEMSCAP. The fabricated accelerometer device is then post-processed by depositing a layer of amorphous silicon carbide to form a composite sensor structure to improve its performance over an extended wide temperature range. We designed and fabricated a CMOS readout circuit in IBM 0.13μm process that interfaces with the accelerometer device to serve as a capacitance to voltage converter. The accelerometer device is designed to operate over a measurement range of ±20g. The described sensor system allows low power, low cost and mass-producible implementation well suited for a variety of applications with harsh or wide temperature operating conditions.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"8973 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design and fabrication of three-axis accelerometer sensor microsystem for wide temperature range applications using semi-custom process\",\"authors\":\"A. Merdassi, Y. Wang, G. Xereas, V. Chodavarapu\",\"doi\":\"10.1117/12.2037344\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes an integrated CMOS-MEMS inertial sensor microsystem, consisting of a 3-axis accelerometer sensor device and its complementary readout circuit, which is designed to operate over a wide temperature range from - 55°C to 175°C. The accelerometer device is based on capacitive transduction and is fabricated using PolyMUMPS, which is a commercial process available from MEMSCAP. The fabricated accelerometer device is then post-processed by depositing a layer of amorphous silicon carbide to form a composite sensor structure to improve its performance over an extended wide temperature range. We designed and fabricated a CMOS readout circuit in IBM 0.13μm process that interfaces with the accelerometer device to serve as a capacitance to voltage converter. The accelerometer device is designed to operate over a measurement range of ±20g. The described sensor system allows low power, low cost and mass-producible implementation well suited for a variety of applications with harsh or wide temperature operating conditions.\",\"PeriodicalId\":395835,\"journal\":{\"name\":\"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components\",\"volume\":\"8973 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2037344\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2037344","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design and fabrication of three-axis accelerometer sensor microsystem for wide temperature range applications using semi-custom process
This paper describes an integrated CMOS-MEMS inertial sensor microsystem, consisting of a 3-axis accelerometer sensor device and its complementary readout circuit, which is designed to operate over a wide temperature range from - 55°C to 175°C. The accelerometer device is based on capacitive transduction and is fabricated using PolyMUMPS, which is a commercial process available from MEMSCAP. The fabricated accelerometer device is then post-processed by depositing a layer of amorphous silicon carbide to form a composite sensor structure to improve its performance over an extended wide temperature range. We designed and fabricated a CMOS readout circuit in IBM 0.13μm process that interfaces with the accelerometer device to serve as a capacitance to voltage converter. The accelerometer device is designed to operate over a measurement range of ±20g. The described sensor system allows low power, low cost and mass-producible implementation well suited for a variety of applications with harsh or wide temperature operating conditions.