用高温加速寿命试验评估印制板组件的故障率

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626864

Choong-Reol Young, J. Yoo

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引用次数: 0

摘要

本文综述了国内外应用高温加速寿命试验方法评估开关系统印制板组件可靠性的研究进展。印制板组件具有多种不同种类、复杂程度各异的元器件，可靠性评估测试对故障分类具有重要意义。考虑到印制板组件的复杂性，我们计算了加速因子。利用阿伦尼乌斯获得的加速因子，用30个样品进行了为期2个月的实际加速试验。应用威布尔-对数线性模型对试验结果进行了分析。分析表明，设计特性足以满足可靠性要求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

In this paper, we summarize the work in the field of assessing the reliability of printed board assemblies of a switching system, applying the method of the high temperature accelerated life-test. A test for reliability assessment of printed board assemblies having many different kinds of components in a large variety of complexity is very important to classify the failures. We calculate the acceleration factor of taking into consideration of the complexity of a printed board assembly. An actual accelerated test with accelerated factors obtained by the Arrhenius are conducted with 30 samples during two months. Test result are analyzed applying the Weibull-log linear model. The analysis show that the design characteristics are adequate to satisfy the requirement of reliability.

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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