{"title":"倒装芯片封装的几个可靠性问题","authors":"Sheng Liu, Jianjun Wang, Z. Qian","doi":"10.1109/ICSICT.1998.785943","DOIUrl":null,"url":null,"abstract":"In this paper, several reliability-related mechanics problems in flip-chip packages are discussed. These problems include failure modes (cracking and delamination) and prevention, underfill selection and design, board design effect of processing induced defects (settling effect, incomplete fill, debonding), ball pitch effect, solder joint fatigue, and reliability of conductive epoxy.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Several reliability related issues for flip-chip packaging\",\"authors\":\"Sheng Liu, Jianjun Wang, Z. Qian\",\"doi\":\"10.1109/ICSICT.1998.785943\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, several reliability-related mechanics problems in flip-chip packages are discussed. These problems include failure modes (cracking and delamination) and prevention, underfill selection and design, board design effect of processing induced defects (settling effect, incomplete fill, debonding), ball pitch effect, solder joint fatigue, and reliability of conductive epoxy.\",\"PeriodicalId\":286980,\"journal\":{\"name\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT.1998.785943\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.785943","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Several reliability related issues for flip-chip packaging
In this paper, several reliability-related mechanics problems in flip-chip packages are discussed. These problems include failure modes (cracking and delamination) and prevention, underfill selection and design, board design effect of processing induced defects (settling effect, incomplete fill, debonding), ball pitch effect, solder joint fatigue, and reliability of conductive epoxy.