用于高级生命信号探测的汽车内部雷达

Esref Turkmen, C. Zerna, Hamza Kandis, Ramona Hotopan, W. Debski, S. Scherbaum, A. Ott, Leonardo Govoni, A. Drost, Roger Frederick Dupont, Johann Josef Balbach-Sobkowicz
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引用次数: 1

摘要

具有射频性能的欧洲源,首次基于2FDX技术,允许工作频率超过100GHz (~ 120ghz)的低功耗设计。用于120 GHz应用的薄雷达IC将嵌入硅基晶圆的空腔和/或新型玻璃基中间层结构中,并与直接位于IC旁边的天线电互连。用于IC,天线和互连的射频电路将通过3D全波EM模拟共同设计。这种方法可以在制造前对整个IC/天线封装进行射频仿真和优化。射频封装在晶圆级采用标准半导体技术,确保了极高的互连几何精度和最佳电气性能。整个系统由模拟雷达前端组成,采用创新的大容量封装解决方案实现天线;组装成电路板(PCB)与附加功能实现演示传感器系统。雷达信号处理实例将用于处理传感器PCB的数据流,以便将传感器数据结果提供给后端系统。此次演示将展示安装在真实车辆环境中的工作频率超过100GHz (~ 120ghz)的毫米波雷达解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Car Interior Radar for Advanced Life-Signs Detection
European source with RF performance allowing low-power designs with operating frequencies beyond 100GHz (∼120 GHz) based on 2FDX technology for the first time. A thin RADAR IC for 120 GHz applications will be embedded in cavities of a silicon base wafer and/or into novel glass-based interposer structures and electrically interconnected to an antenna that is located directly aside the IC. RF circuits for IC, antenna and interconnects will be co-designed by 3D full wave EM simulations. This approach enables RF simulation and optimization of the whole IC/antenna package before manufacture. The use of standard semiconductor technology for the RF package on wafer-level ensures very high precision of interconnect geometry and optimum electrical performance. The entire system consists of an analog radar frontend implementing antennas in innovative mass volume packaging solution; assembled to a board (PCB) with additional functionality realizing the demonstrator sensor system. The radar signal processing instance will be used to process the data stream of sensor PCB in order to provide sensor data results to backend systems. The demonstrator will showcase a mm-wave radar solution operating beyond 100GHz (∼120 GHz) installed in a real vehicle environment.
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