检查无铅焊接替代品对环境的影响

L. Turbini, G. C. Munie, D. Bernier, J. Gamalski, D. W. Bergman
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引用次数: 66

摘要

表面贴装委员会已将无铅电子产品问题确定为关注和评估的新兴领域,这是由欧盟(EU)关于电气和电子设备废物(WEEE)指令的提案以及日本对环境营销和回收的关注引发的,这导致了消除铅的时间表。从工业生态学的角度来看,有必要评估所提出的替代品的环境影响,并将其与现有的锡/铅焊料进行比较。工业生态学是对工业系统和经济活动及其与基本自然系统联系的多学科研究。基于这个定义,反思无铅电子产品在其整个生命周期中对环境的影响是很重要的。这包括合金可用性、加工考虑、能源使用和地下水污染等因素。基于这些标准,无铅产品并不比目前用Sn/Pb焊接的电子产品更环保。因此,未来监管的重点应该放在报废金属的回收和再循环上,而不是消除铅基焊料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Examining the environmental impact of lead-free soldering alternatives
The Surface Mount Council has identified the issue of lead-free electronics as an emerging area for concern and evaluation This has been triggered by the European Union's (EU) proposal for a Directive on Waste from Electrical and Electronic Equipment (WEEE) and by the Japanese focus on environmental marketing and on recycling which has resulted in timetables for lead elimination. From an industrial ecology perspective, it is essential to evaluate the environmental impact of the proposed alternatives and to compare those with that of the present Sn/Pb solder. Industrial ecology is the multidisciplinary study of industrial systems and economic activities, and their links to fundamental natural systems. Based on this definition, it is important to reflect on the environmental impact of lead-free electronics through their entire life cycle. This includes factors such as alloy availability, processing considerations, energy use and ground water contamination. Based on these criteria, lead-free products are not more environmentally friendly than the present electronics soldered with Sn/Pb. Thus, the focus of future regulation should be on recovery and recycling of the metals at end-of-life as required in the WEEE rather than the elimination of lead-based solder.
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