通过修改EBG结构来减少堆叠封装中的电磁干扰

2009 11th Electronics Packaging Technology Conference Pub Date : 2009-12-01 DOI:10.1109/EPTC.2009.5416493

F. Chang, Kuan-Wen Cheng, S. Wu

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引用次数: 1

摘要

在本文中，我们研究了嵌入在多层板中的电磁带隙结构(EBG)以减轻相邻板中的电磁干扰。本文提出的新型EBG结构的设计依赖于细线和斑块的修改。细线用来提供等效电感。仿真结果可以有效抑制任意频段的噪声。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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EMI reducing solution by modify EBG structure for stacked packaging

In this paper, we investigated the Electromagnetic Bandgap structure (EBG) is embedded in a multi-layer board to mitigate EMI in an adjacent board. The design of the new EBG structure proposed here relies on the modification of thin lines and patches. The thin lines serve to provide the equivalent inductances. Simulation results can suppress any frequency band noise effectively.

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2009 11th Electronics Packaging Technology Conference

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