银欧姆接触P-GaN的一种新型表面处理方法

Chenglin Qi, Qinjin Wang, Li Wang, Zhiqiang Liu, X. Yi, Jinmin Li, Junxi Wang
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引用次数: 1

摘要

随着gan基发光二极管(led)的发展,对电阻率低、热稳定性好、反射率高的p-GaN触点的需求变得更加迫切。本文提出了一种新的p-GaN表面处理方法,使p-GaN与Ag之间形成良好的欧姆接触。我们提出了一种具有Ag/超薄ITO/p-GaN接触的新结构,由于ITO的一些孤岛和Ni层的缺失,该结构具有低接触电阻率和高反射率。基于CTLM方法计算的新结构的ρc值小于7×10−2W/cm2,表明Ag/超薄ITO/p-GaN触点的接触电阻率低于没有超薄ITO层的触点(ρc值大于2W/cm2), Ag膜不能被胶带撕掉,具有良好的粘附性。与传统led相比,用这种触点制造的led在20mA正向电流下的亮度提高了30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel surface treatment for the sliver ohmic contacts to P-GaN
With the development of the GaN-based light-emitting diodes (LEDs), the need for p-GaN contacts with low resistivity, good thermal stability, and high reflectivity has become more urgent. In this paper, a novel method of surface treatment on p-GaN to form good ohmic contacts between p-GaN and Ag was proposed. We proposed a novel structure with Ag/ultrathin-ITO/p-GaN contact which shows a low contact resistivity as well as a high reflectance attributed to some isolated islands of ITO and the absence of Ni layer. The calculated ρc of the new structure which is lower than 7×10−2W/cm2 based on the CTLM method showed that the Ag/ultrathin-ITO/p-GaN contact has a lower contact resistivity compared to the contact without the ultrathin ITO layer of which the ρc is higher than 2 W/cm2 The Ag film cannot be ripped off by the tape which shows a good adhesion. The LEDs fabricated with this contacts showed a 30% higher luminance at 20mA forward currents as compared to the conventional LEDs.
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