在高级合成中通过多路复用实现TSV计数最小化的TSV共享

Wen-Pin Tu, Yen-Hsin Lee, Shih-Hsu Huang
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引用次数: 10

摘要

TSV计数最小化是三维集成电路的一个重要课题。在以往的工作中,TSV共享仅限于相同的功能单元输出和相同的功能单元输入。在本文中,我们首次尝试使用多路复用器来扩展TSV共享,以实现具有不同功能单元输出和不同功能单元输入的跨层数据传输。我们使用整数线性规划(ILP)来正式制定资源绑定,层分配和TSV共享(通过多路复用)的同时应用,以最小化TSV计数。与以往的工作相比,我们的方法可以大大进一步减少TSV计数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
TSV sharing through multiplexing for TSV count minimization in high-level synthesis
TSV count minimization is an important topic for 3D ICs. In previous works, TSV sharing is limited to the same functional unit output and the same functional unit input. In this paper, we present the first attempt to use multiplexers to extend TSV sharing for cross-layer data transfers that have different functional unit outputs and different functional unit inputs. We use an ILP (integer linear programming) to formally draw up the simultaneous application of resource binding, layer assignment, and TSV sharing (through multiplexing) to minimize the TSV count. Compared with previous works, our approach can greatly further reduce the TSV count.
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