超薄SOI IGBT漏电流及高温工作的新器件结构

T. Matsudai, Y. Yamaguchi, N. Yasuhara, A. Nakagawa, H. Mochizuki
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引用次数: 4

摘要

本文描述并比较了薄SOI上mosfet(二极管)和light的漏电流和导通电阻的温度依赖性。泄漏电流随着SOI层厚度的减小而有效减小。在高温下,如200/spl℃,薄SOI上igbt的正向压降没有明显恶化。另一方面,随着SOI层厚度的减小,开关速度提高。因此,薄SOI器件是高温操作的良好候选者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thin SOI IGBT leakage current and a new device structure for high temperature operation
This paper describes and compares the temperature dependence of leakage current and on-state resistance of MOSFETs (diodes) and LIGBTs on thin SOI. The leakage current decreases effectively as the SOI layer thickness decreases. The forward voltage-drop of IGBTs on thin SOI is not significantly deteriorated at a high temperature, such as 200/spl deg/C. On the other hand, switching speed improves as the SOI layer thickness decreases. Thus, a thin SOI device is a good candidate for high temperature operation.
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